Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-05-30
2006-05-30
Crispino, Richard (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C264S437000, C264S460000, C264S496000, C264S109000
Reexamination Certificate
active
07052570
ABSTRACT:
A method for producing a capillary bead array comprises the steps of: dispensing beads into a liquid pool, outside a capillary, having a depth of almost the same length as the particle diameter of a bead; leveling the excessive beads by moving a leveling member which is in contact with and relatively capable of be moved to the liquid pool to remove excessive beads that the liquid pool cannot contain; aligning the beads in the liquid pool one- or two-dimensionally; bonding adjacent individual beads to each other; producing a structure having the plurality of beads bonded and aligned one- or two-dimensionally; removing the structure from the liquid pool; and disposing the structure in the capillary formed of soft resin, so that the beads comprising the plurality of beads retaining the one- or two-dimensional alignment can be introduced simultaneously into the capillary. This method reduces the time and cost necessary for bead array production and retains the bead alignment in the capillary, resulting in improved accuracy and reliability in experiments using the capillary array.
REFERENCES:
patent: 3309737 (1967-03-01), MacMillan
patent: 6096159 (2000-08-01), Ito et al.
patent: 6340588 (2002-01-01), Nova et al.
patent: 6863847 (2005-03-01), Fu et al.
patent: 2002/0039732 (2002-04-01), Bruchez et al.
patent: WO 00/61198 (2000-04-01), None
patent: WO 2004/024328 (2003-09-01), None
Marshall, Andrew, “DNA Chips: An array of possibilities”, Nature Biotechnology, vol. 16, Jan. 1998, pp. 27-31.
European Search Report dated Jul. 21, 2004.
Kishida Hiroshi
Kogi Osamu
A. Marquez, Esq. Juan Carlos
Crispino Richard
Fisher Esq. Stanley P.
Hitachi Software Engineering CO, Ltd.
Reed Smith LLP
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