Baths and processes for electrodepositing palladium

Details Baths and processes for electrodepositing palladium Baths and processes for electrodepositing palladium

1980-10-01

1982-07-13

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 352

Patent

active

043393110

ABSTRACT:
A process for electrodeposition of palladium is described wherein an electroplating bath comprising a palladium(II) compound is employed which electroplating bath is ammonia-free. The bath contains water and an amine of the formula ##STR1## wherein x=0 or 1 and when x=0: ##STR2## and when x-1: R.sup.1 =N(CH.sub.3) (CH.sub.2).sub. 3 NH.sub.2, NH(CH.sub.2).sub. 2 NH.sub.2, NH(CH.sub.2).sub. 2 NH(CH.sub.2).sub. 3 NH.sub.2, NH.sub.2, OH or C.sub.1-4 -alkoxy, R.sup.2, R.sup.3, R.sup.4 =H or CH.sub.3.
The amine permits the electrodeposition of palladium at a current density above 2.5 A/dm.sup.2 and the resultant coatings are semi-glossy to glossy and are characterized by firm adhesion and freedom of pores. The coatings have only low internal tensions.

REFERENCES:
patent: 1981715 (1934-11-01), Atkinson
patent: 4144141 (1979-03-01), Schuster et al.
patent: 4242180 (1980-12-01), Heppner et al.
patent: 4278514 (1981-07-01), Morrissey

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