Bath for immersion plating tin-lead alloys

Details Bath for immersion plating tin-lead alloys Bath for immersion plating tin-lead alloys

1990-05-29

1992-11-03

Marquis, Steven

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

106 122, 106 125, C25D 332, C25D 336

Patent

active

051604221

ABSTRACT:
The invention provides a bath for immersion plating a substance with a tin-lead alloy, which includes tin(II) ions, lead(II) ions, organic sulfo groups and thiourea or a mixture of thiourea and a thiourea derivative for a complexing agent. The organic sulfo groups allow insoluble thiourea complexes to be stably dissolved in the solution of the bath; thereby there is no need to retain the bath at a high temperature. Compared with conventional baths for immersion plating, the bath of the invention attains stable plating and a longer life of itself. Addition of the thiourea derivative prevents whiskers from being deposited and allows uniform and sufficiently smooth plating.

REFERENCES:
patent: 4194913 (1980-03-01), Davis
patent: 4511403 (1985-04-01), Orio et al.
patent: 4749626 (1988-06-01), Kadija et al.
patent: 4849059 (1989-07-01), Deresh et al.

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