Bath composition and method for copper-tin-zinc alloy electropla

Details Bath composition and method for copper-tin-zinc alloy electropla Bath composition and method for copper-tin-zinc alloy electropla

1983-06-24

1985-01-29

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 358

Patent

active

044964382

ABSTRACT:
An alkaline, cyanide, aqueous electroplating composition of copper, tin, and zinc includes a small amount of nickel to enhance the inclusion of tin in the copper-tin-zinc plate deposited from the solution. The plate resists tarnishing by a corrosion test solution, and retains its bright silvery-colored appearance because the plate preferably includes at least about 10.9 atomic wt % tin. The plating method for enhanced tin alloys through nickel additions to the bath is also described.

REFERENCES:
G. F. Jacky, Plating, vol. 58, No. 9, pp. 883-887, Sep. 1971.

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