Bath and process for the electrodeposition of ruthenium

Chemistry: electrical and wave energy – Processes and products

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204 47, C25D 350, C25D 356

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043753922

ABSTRACT:
Improved baths for the electrodeposition of ruthenium metal on various substrates. The ruthenium metal baths are formulated with a complex of ruthenium metal and sulphamic acid wherein the molar ratio is one mole of ruthenium metal and from about 4 to 10 moles of sulphamic acid. For most purposes, certain selective metals are also present in the baths, which are maintained at a pH ranging from about 1.0 to 2.2. The process for utilizing said baths to plate substrates with essentially pure ruthenium metal is also described and claimed.

REFERENCES:
patent: 2600175 (1952-06-01), Volterra
patent: 3625840 (1971-12-01), Mason et al.
patent: 3630856 (1971-12-01), Meyer
patent: 3892638 (1975-07-01), Stevens et al.
F. H. Reid et al., Trans. Inst. Metal Finishing, 38, 45, (1961).
G. A. Conn, Plating, pp. 1038-1040, Sep. 1969.

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