Bath and process for plating tin, lead and tin-lead alloys

Chemistry: electrical and wave energy – Processes and products

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204 5354R, C25D 332, C25D 336, C25D 356, C25D 360

Patent

active

045656096

ABSTRACT:
This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, an alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound.

REFERENCES:
patent: 2525942 (1950-10-01), Proell
patent: 3663384 (1972-05-01), Lescure
patent: 3905878 (1975-09-01), Dohi et al.
patent: 4000047 (1976-12-01), Ostrow et al.
patent: 4132610 (1979-01-01), Dohi et al.
patent: 4384930 (1983-05-01), Eckles
patent: 4388158 (1983-06-01), Inui et al.
patent: 4459185 (1984-07-01), Obata et al.
Dohi et al., "Bright Solder and Indium Plating from Methane Sulfonic Acid", Proceeding of Electroplating Seminar, 7/78.
Dohi et al., "Electrodeposition of Bright Tin-Lead Alloys from Alkanolsulfonate Baths", proceedings of Interfinish 80.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bath and process for plating tin, lead and tin-lead alloys does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bath and process for plating tin, lead and tin-lead alloys, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bath and process for plating tin, lead and tin-lead alloys will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2297115

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.