Bath and process for plating tin/lead alloys on composite substr

Details Bath and process for plating tin/lead alloys on composite substr Bath and process for plating tin/lead alloys on composite substr

1985-09-11

1987-02-03

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 502

Patent

active

046407464

ABSTRACT:
An electroplating bath and process for electroplating composite substrates having an electroplatable metallic portion and a non-conductive inorganic portion with a tin-lead alloy which will plate only on the metallic portions of the substrate and not plate on or otherwise adversely affect the non-conductive inorganic portions.

REFERENCES:
patent: 3769182 (1973-10-01), Hsu
patent: 3905878 (1975-09-01), Dohi et al.
patent: 3984291 (1976-10-01), Lerner et al.
patent: 4000047 (1976-12-01), Ostrow et al.
patent: 4118289 (1978-10-01), Hsu
patent: 4163700 (1979-08-01), Igarashi et al.

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