Bath and process for plating tin-lead alloys

Details Bath and process for plating tin-lead alloys Bath and process for plating tin-lead alloys

1986-09-04

1987-07-21

Demers, Arthur P.

Chemistry: electrical and wave energy

Processes and products

204 431, C25D 332, C25D 336, C25D 356, C25D 360

Patent

active

046816704

ABSTRACT:
An electroplating bath and process for electroplating substrates with a tin-lead alloy from an electrolyte containing a soluble tin compound, a soluble lead compound and a complexing agent in an amount sufficient to maintain the metals in solution. Th electrolyte has a pH range of about 1.5 to 5.5 and is free from substantial amounts of free acid or free base components.

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