Bath and process for high speed electroplating of palladium

Details Bath and process for high speed electroplating of palladium Bath and process for high speed electroplating of palladium

1985-01-29

1985-10-08

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 352

Patent

active

045458693

ABSTRACT:
A palladium electroplating bath capable of plating highly ductile palladium metal. The bath comprises a palladium amine complex salt as a source of the palladium metal, ammonium sulfate, an ammonium halide, an alkali metal pyrophosphate, a stress reducing agent, and a minor amount of cyanide ions. In general, the cyanide ions are furnished to the bath by the addition of alkali metal cyanide. The pH of the bath will range from about 7 to 9. Electrolytic deposition will be carried out at a temperature of from about 50 to 80 degrees C. at high current densities up to about 3000 ASF. The method of depositing ductile palladium foil on a variety of substrates is also described and claimed.

REFERENCES:
patent: 2452308 (1948-10-01), Lambros
patent: 4098656 (1978-07-01), Deuber

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