Bath and process for electroplating tin, lead and tin/alloys

Chemistry: electrical and wave energy – Processes and products

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204 53, 204 541, C25D 332, C25D 336, C25D 356, C25D 360

Patent

active

047012447

ABSTRACT:
The invention relates to the electrolytic plating of tin and lead metals and particularly to tin-lead alloys by dissolving divalent tin or lead compounds in an excess of a lower alkyl sulfonic acid or acid salt. The electrolytic bath comprises such additives as benzal acetone, benzaldehyde or derivatives thereof, aromatic pyridines; surfactants such as betaines, alkylene oxides polymers, imidazolinium compounds and quaternary ammonium salts and formaldehyde.

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