Bath and method of electroless plating of silver on metal...

Details Bath and method of electroless plating of silver on metal... Bath and method of electroless plating of silver on metal...

2005-03-22

2005-03-22

Jolley, Kirsten (Department: 1762)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S125000, C427S436000, C427S437000, C106S001140, C106S001190, C106S001230

Reexamination Certificate

active

06869637

ABSTRACT:
Known methods of improving the solderability of copper surfaces on printed circuit boards present the disadvantage that outer layers of an irregular thickness are formed at the metal surfaces, that these layers are very expensive or that the constituents used in manufacturing them are harmful to the environment. Furthermore, the metal surfaces are to be suited to form bond connections as well as electrical contacts. To overcome these problems there are disclosed a bath and a method of electroless plating of silver by way of charge exchange reaction on surfaces of metals that are less noble than silver, more particularly on copper, that contain at least one silver halide complex and not containing any reducing agent for Ag+ions.

REFERENCES:
patent: 2602757 (1952-07-01), Kantrowitz et al.
patent: 3294578 (1966-12-01), Popeck
patent: 4939119 (1990-07-01), Iwata et al.
patent: 5871896 (1999-02-01), Royster et al.
patent: 5955141 (1999-09-01), Soutar et al.
patent: 6045725 (2000-04-01), Udaka et al.
patent: 31 48330 (1981-12-01), None
patent: 0 081 183 (1987-05-01), None
patent: 0 797 380 (1997-09-01), None
patent: 1022061 (1966-03-01), None
patent: 2 201 163 (1998-08-01), None
patent: 05287542 (1993-11-01), None
patent: 06240463 (1994-08-01), None
patent: 09302476 (1997-11-01), None
patent: 10130855 (1998-05-01), None
patent: A-501116 (1976-01-01), None
patent: 9617974 (1996-06-01), None
patent: 9617975 (1996-06-01), None
XP-00218810, Journal of the Electrochemical Society pp. C28-C33 Electroless Silver Deposition in 100 nm Silicon Structures, 2001.
Derwent abstract 1976-84390X.
J. Electrochem. Soc. India (1976) vol. 16 Immersion and Electroless Plating of Silver Over Copper By S. Lakshminarasimhan and P.B. Mathur Central Electrochemical Research Institute, Karaikudi-3 (S. Rly.) pp. 85-89.
Inorganic Chemistry, F.A. Cotton and G. Wilkinson, pp. 987 and 988, no date provided.

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