Bath and method for the electroless plating of tin and tin-lead

Details Bath and method for the electroless plating of tin and tin-lead Bath and method for the electroless plating of tin and tin-lead

1992-07-01

1993-11-30

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Pore forming

106 125, C23C 1852

Patent

active

052661032

ABSTRACT:
A tin or tin-lead alloy electroless plating bath comprising (A) a stannous salt or a mixture of a stannous salt and a lead salt, (B) an acid, (C) thiourea or a thiourea derivative, and (D) a reducing agent is improved by adding (E) a nonionic surfactant and optionally, (F) a cationic surfactant, a nitrogenous heterocyclic compound or a derivative thereof, or alternatively by adding (G) an ammonium or quaternary ammonium ion. From the bath, uniform films of fine grains will chemically deposit on fine pitch printed wiring boards intended for SMT.

REFERENCES:
patent: 4093466 (1978-06-01), Davis
patent: 4194913 (1980-03-01), Davis
patent: 4234631 (1980-11-01), Davis
patent: 4550037 (1985-10-01), Kinkelaar et al.
patent: 4816070 (1989-03-01), Holtzman et al.
patent: 4997686 (1991-03-01), Feldstein et al.
patent: 5143544 (1992-09-01), Iantosca
patent: 5145517 (1992-09-01), Feldstein et al.
patent: 5147454 (1992-09-01), Nishihara et al.
English translation of Abstract of Japanese Patent Apln. Kokai 1-184279 1989.

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