Batch process providing beam leads for microelectronic devices h

Details Batch process providing beam leads for microelectronic devices h Batch process providing beam leads for microelectronic devices h

1975-11-07

1978-04-25

Goolkasian, John T.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 89, 427 91, 427 99, 427124, 427125, 156645, 156650, 156656, 156657, 29578, 29583, 29576R, B05D 512, H01L 2100

Patent

active

040863751

ABSTRACT:
A monometallic batch process for forming beam leads of a preferred metal such as aluminum or gold. The process is applied to a wafer of finished microelectronic devices already having metal contact pads of the same preferred metal. Where aluminum is the desired metal, high deposition rates are used to minimize aluminum oxide contamination. High yield is achieved by forming the beam leads to have an elevated cantilevered configuration, by deep scribing of the wafer and, when desired, by providing an energy absorbing cushion to reduce the effect of collisions between chip edges and beam leads.

REFERENCES:
patent: 3461537 (1969-08-01), Lotz
patent: 3550261 (1970-12-01), Schroeder
patent: 3639811 (1972-01-01), Schroeder
patent: 3653999 (1972-04-01), Fuller
patent: 3699010 (1972-10-01), Nash
patent: 3700497 (1972-10-01), Epifano et al.
patent: 3783056 (1974-01-01), Keller et al.
patent: 3890177 (1975-06-01), Pfahnl et al.
patent: 3890636 (1975-06-01), Harada et al.
patent: 3925880 (1975-12-01), Rosvold

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