Base substrate of multichip module and method for inspecting the

Details Base substrate of multichip module and method for inspecting the Base substrate of multichip module and method for inspecting the

1993-02-05

1996-10-15

Nguyen, Vinh P.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

G01R 3104

Patent

active

055657672

ABSTRACT:
A plurality of bare semiconductor IC chips are mounted on a base substrate. The base substrate and IC chips are sealed in a package to constitute a multichip module. Diodes are disposed on the base substrate so that an end of each diode is connected to a terminal for connecting each IC chip with said base substrate and the other end thereof is connected to a prescribed voltage. As a result, it is possible to inspect the base substrate by contacting probes only with a connecting pad between the base substrate and a package, to reduce the number of pins of a probe card, to produce a cheap probe card and to reduce a rate of imperfect contact between the probe card and an inspecting pad.

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patent: 4720671 (1988-01-01), Tada et al.
patent: 4779041 (1988-10-01), Williamson, Jr.
patent: 5280237 (1994-01-01), Buks
Keezer, "Bare Die Testing and MCM Probing Techniques", IEEE (1992), pp. 20-23.
Parker, "Bare Die Test", IEEE (1992), pp. 24-27.
Beiley et al., "Array Probe Card", IEEE (1992), pp. 28-31.
Hubacher; "Ensuring proper probe contact during the testing of Integrated circuit chips"; IBM Technical Disclosure Bulletin; vol. 15, No. 11; Apr. 1973.

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