Base for encapsulating components with coplanar electrodes

Details Base for encapsulating components with coplanar electrodes Base for encapsulating components with coplanar electrodes

1981-10-26

1984-01-10

Edlow, Martin M.

357 68, 357 70, 357 75, 357 80, H01L 2302, H01L 3902, H01L 2316, H01L 2348

Patent

active

044255756

ABSTRACT:
A base comprising a metal mounting stud to which is fixed a locally metallized insulating plate of the beryllium oxide type. In order to very accurately position active or passive component or components on the insulating plate, at least one connecting electrode comprises at least one abutment zone against which is placed at least one component. This makes it possible to obtain a very good reproducibility of the electrical performances of the device. Such a mounting is applied to ultra-high frequency devices, particularly those incorporating a pre-matching circuit.

REFERENCES:
patent: 3996603 (1976-12-01), Smith

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