Coating processes – Nonuniform coating – Deforming the base or coating or removing a portion of the...
Patent
1998-12-10
2000-05-16
Parker, Fred J.
Coating processes
Nonuniform coating
Deforming the base or coating or removing a portion of the...
427277, 427369, 427408, B05D 132, B05D 706
Patent
active
060634448
ABSTRACT:
A bas-relief is formed on a wooden panel, such as a furniture panel, by using a MYLAR.RTM. stencil having the outline of a design forming the bas-relief and a rubber stamp having a negative of the relief incorporating depth and textural features of the design. The MYLAR.RTM. stencil is laid over the panel and spackle is applied over the stencil to form a spackle layer having the outline of the design. The spackle layer is then embossed with the rubber stamp to provide details of depth in the spackle layer and thus form the bas-relief. The bas-relief is then allowed to dry, is painted or glazed and is covered with a layer of varnish.
REFERENCES:
patent: 278238 (1883-05-01), Harding
patent: 333459 (1885-12-01), Gibson
patent: 415427 (1889-11-01), Wick
patent: 591245 (1897-10-01), Carlewitz
patent: 613625 (1898-11-01), Furness
patent: 683425 (1901-10-01), Anderson et al.
patent: 774607 (1904-11-01), Schmitt
patent: 1053937 (1913-02-01), Anderson
patent: 2026202 (1935-12-01), Zeve
patent: 2468731 (1949-05-01), Borkland
patent: 2704905 (1955-03-01), Ernst
patent: 3287193 (1966-11-01), Klein
patent: 3444032 (1969-05-01), Kreier, Jr.
patent: 3537874 (1970-11-01), Ramey
patent: 3672926 (1972-06-01), Ramey
patent: 3744152 (1973-07-01), Crasilneck
patent: 4135020 (1979-01-01), Maxwell
patent: 4268615 (1981-05-01), Yonezawa
patent: 4677001 (1987-06-01), Wade et al.
patent: 5133621 (1992-07-01), Gonzales
Niermann Weeks Company, Inc.
Parker Fred J.
LandOfFree
Bas-relief process does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bas-relief process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bas-relief process will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-256658