Barrier metallization in ceramic substrate for implantable medic

Details Barrier metallization in ceramic substrate for implantable medic Barrier metallization in ceramic substrate for implantable medic

1999-03-31

2000-11-14

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

174257, 428901, 607 5, 607 9, 607119, B32B 300

Patent

active

06146743&

ABSTRACT:
The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.

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