Barrier layer treatments for tungsten plug

Details Barrier layer treatments for tungsten plug Barrier layer treatments for tungsten plug

1994-12-30

1997-02-04

Kunemund, Robert

Fishing, trapping, and vermin destroying

437192, 437246, H01L 21443

Patent

active

055997392

ABSTRACT:
Tungsten plugs are formed by passivating a substrate having a contact hole with SiH.sub.4, forming a nucleation layer on the passivated substrate by reducing WF.sub.6 with SiH.sub.4 at relatively low pressures and depositing tungsten to substantially fill the contact hole by reducing WF.sub.6 with H.sub.2 at relatively high pressures. Alternatively, rapid thermal annealing is used to cure pinhole defects in a titanium nitride layer on a substrate to avoid the formation of unwanted tungsten volcanoes.

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