Barrier layer arrangement for conductive layers on silicon subst

Superconductor technology: apparatus – material – process – High temperature – per se – Having tc greater than or equal to 150 k

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

505701, 505702, 505704, 428209, 428332, 428333, 428334, 428446, 428448, 428457, 428469, 428901, 428341, 428472, 174256, 361397, B32B 900

Patent

active

049083481

ABSTRACT:
A barrier layer triad intended to protect a silicon substrate and an overlying conductive layer from mutual contamination is disclosed as well as a process for its preparation. The barrier layer triad is comprised of a first triad layer located adjacent the silicon substrate consisting essentially of silica, a third triad layer remote from the silicon substrate consisting essentially of at least one Group 4 heavy metal oxide, and a second triad layer interposed between the first and third triad layers consisting essentially of a mixture of silica and at least one Group 4 heavy metal oxide.

REFERENCES:
Y-Ba-Cu-O Superconductor Film, Gupta et al., Appl. Phys. Lett., vol. 52 (23), 6/88, 1987-88.
J. G. Bednorz and K. A. Muller, "Possible High T.sub.c Superconductivity in the Ba-La-Cu-O System", Z. Phys. B. Condensed Matter, vol. 64, pp. 189-193 (1986).
C. W. Chu, P. H. Hor, R. L. Meng, L. Gao, Z. J Huang, and Y. Q. Wang, "Evidence for Superconductivity above 40 K in the La-Ba-Cu-O Compound System", Physical Review Letters, vol. 53, No. 4, pp. 405-407, Jan. 1987.
C. W. Chu, P. H. Hor, R. L. Meng, L. Gao, and Z. J. Huang, "Superconductivity at 52.5 K in the Lanthanum-Barium-Copper-Oxide System", Science Reports, vol. 235, pp. 567-569, Jan. 1987.
R. J. Cava, R. B. vanDover, B. Batlog, and E. A. Rietman, "Bulk Superconductivity at 36 K in La.sub.1.8 Sr.sub.0.2 CuO.sub.4 ", Physical Review Letters, vol. 58, No. 4, pp. 408-410, Jan. 1987.
J. M. Tarascon, L. H. Greene, W. R. McKinnon, G. W. Hull, and T. H. Geballe, "Superconductivity at 40 K in the Oxygen-Defect Perovskites La.sub.2-x Sr.sub.x CuO.sub.4-y ", Science Reports, vol. 235, pp. 1373-1376, Mar. 13, 1987.
M. K. Wu, J. R. Ashburn, C. J. Torng, P. H. Hor, R. L. Meng, L. Gao, Z. J. Huang, Y. Q. Wang, and C. W. Chu, "Superconductivity at 93 K in a New Mixed-Phase Y-Ba-Cu-O Compound System at Ambient Pressure", Physical Review Letters, vol. 58, No. 9, pp. 908-910, Mar. 2, 1987.
C. E. Rice et al., "Preparation of Superconducting Thin Films of Ba.sub.2 YCu.sub.3 O.sub.7 by a Novel Spin-On Pyrolysis Technique," Appl. Phys. Left., vol. 51, No. 22, pp. 1842-2844 (1987).
A. H. Hamdi et al., "Formation of Thin-Film High Tc Superconductors by Metalorganic Deposition," Appl. Phys. Lett., vol. 51, No. 25, pp. 2152.2154 (1987).
M. E. Gross et al., "Versatile New Metalorganic Process for Preparing Superconducting Thin Films," Appl. Phys. Lett., vol. 52, No. 2, pp. 160-162 (1988).
T. Kumagai et al., "Preparation of Superconducting YBa.sub.2 Cu.sub.3 O.sub.7-d Thin Films by the Dipping-Pyrolysis Process Using Organic Acid Salts," Chemistry Letters, pp. 1645-1646 (1987).
H. Nasu et al., "Superconducting Y-BA-Cu-O Films with Tc>70 K Prepared by Thermal Decomposition Technique of Y-, Ba-, and Cu-2ethylhezanoates", Chemistry Letters, pp. 2403-2404 (1987).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Barrier layer arrangement for conductive layers on silicon subst does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Barrier layer arrangement for conductive layers on silicon subst, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Barrier layer arrangement for conductive layers on silicon subst will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-51281

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.