Barrier film integrity on porous low k dielectrics by...

Details Barrier film integrity on porous low k dielectrics by... Barrier film integrity on porous low k dielectrics by...

2006-06-27

2006-06-27

Luu, Chuong Anh (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C438S637000, C438S643000

Reexamination Certificate

active

07067925

ABSTRACT:
A method for treating a dielectric material using hydrocarbon plasma is described, which allows for thinner films of barrier material to be used to form a robust barrier.

REFERENCES:
patent: 5243222 (1993-09-01), Harper et al.
patent: 6229211 (2001-05-01), Kawanoue et al.
patent: 6677678 (2004-01-01), Biolsi et al.

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