Barrel plating method

Details Barrel plating method Barrel plating method

1998-09-30

2000-07-18

Wong, Edna

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating moving substrate

205145, 205 81, 205 83, 2042281, 2042287, C25D 500, C25D 700, C25D 2112, C25B 1500

Patent

active

060902620

ABSTRACT:
A barrel plating method wherein each box containing pieces to be plated is provided with a kanban corresponding to the pieces contained in the box. The kanban of each box is read by an apparatus before the pieces are transferred from the box to a plating barrel, so that a plating coefficient corresponding to the information read from the kanban is retrieved from a host computer in which plating coefficients for various kinds of pieces are stored. The plating coefficient retrieved corresponding to the kanban of each box is proportional to a value of plating current to be supplied to a unit weight of pieces contained in the box. A value of plating current for each barrel is automatically calculated by multiplying the plating coefficient by the measured weight of the pieces put in the barrel. Barrel plating is performed by supplying each barrel with the value of the calculated plating current from power sources that correspond in number to barrels that are subjected to a plating process at a given time.

REFERENCES:
patent: 4497695 (1985-02-01), Shinkai et al.
patent: 4769117 (1988-09-01), Shiono et al.
patent: 4822468 (1989-04-01), Kanehiro

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