Bare die testing

Details Bare die testing Bare die testing

1996-04-01

1998-07-28

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

G01R 3102

Patent

active

057867011

ABSTRACT:
A testing apparatus for testing integrated circuits at the bare die stage includes a testing station at which microbumps of conductive material are located on interconnection trace terminations of a multilayer interconnection structure, these terminations being distributed in a pattern corresponding to the pattern of contact pads on the die to be tested. To facilitate testing of the die before separation from a wafer using the microbumps, the other connections provided to and from the interconnection structure have a low profile.

REFERENCES:
patent: 4912399 (1990-03-01), Greub et al.
patent: 5317255 (1994-05-01), Suyama et al.
patent: 5374893 (1994-12-01), Koopman et al.
patent: 5576630 (1996-11-01), Fujita

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