Bare die test and burn-in device

Details Bare die test and burn-in device Bare die test and burn-in device

1994-02-22

1995-09-26

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

3241581, 324754, G01R 3102, G01R 1073

Patent

active

054537010

ABSTRACT:
Bare die test device for making temporary electrical connections between bonding pads on the die and external test connectors includes a die chuck, a fanout substrate, and a substrate chuck. The fanout substrate has conductive bumps spaced for registration with die bonding pads. A die chuck receives the die and a substrate chuck holds the fanout substrate. In a fixed alignment embodiment, an alignment arrangement between the die chuck and the substrate chuck provides registration. In an alternative embodiment, the fanout substrate has a backside etched cavity exposing a transparent compliant material. A lower frame provides for lateral and angular positioning of the die chuck relative to the substrate chuck to bring the conductive bumps into alignment with the bonding pads, while visually observing the alignment through the transparent material.

REFERENCES:
patent: 4922192 (1990-05-01), Gross et al.
patent: 5066907 (1991-11-01), Tarzwell et al.
patent: 5148103 (1992-09-01), Pasiecznik, Jr.
1991 Proceedings of International Electronics Packaging Conference.
International Electroics Packaging Society Improving MCM Assembly Yields Through Approaches for Known-Good ICs, by Russell J. Wagner and John K. Hagge, pp. 882-897.

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