Bare chip prober device

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324754, 324765, 414935, G01R 3126, B65G 4907

Patent

active

059528419

ABSTRACT:
A chip is bonded to a tape for ready handling. A flipping mechanism picks up the chip from the tape and sets it in an inverted state. An aligning/mounting mechanism is adapted to align and accurately mount the chip on associated electrodes of a test board. Another flipping mechanism re-sets a post-tested chip onto the tape conveyed by a conveying mechanism.

REFERENCES:
patent: 4956605 (1990-09-01), Bickford et al.
patent: 5189363 (1993-02-01), Bregman et al.
patent: 5510724 (1996-04-01), Itoyama et al.
patent: 5561386 (1996-10-01), Funaki et al.
patent: 5578919 (1996-11-01), Semba et al.
patent: 5614837 (1997-03-01), Itoyama et al.

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