Bare chip mounted structure and mounting method

Details Bare chip mounted structure and mounting method Bare chip mounted structure and mounting method

2011-03-15

2011-03-15

Levi, Dameon E (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S796000, C361S790000, C361S729000, C361S730000, C361S735000

Reexamination Certificate

active

07907420

ABSTRACT:
A plurality of film substrates (2) having a bare chip (1) mounted on one side or both sides are joined into a laminated state by joint portions (3) and are attached to a motherboard (4) through junction by a joint portion (8) at a location off the mounting areas of the bare chips (1), thereby achieving a lower profile, higher lamination, and higher capacity.

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English language Abstract of JP 2001-257309, Sep. 21, 2001.
English language Abstract of JP 2001-257309.
English language Abstract of JP 2004-158536.
English language Abstract of JP 2001-339011.
English language Abstract of JP 10-284684.
English language Abstract of JP 2000-068443.
English language Abstract of JP 2004-356138.
English language Abstract of JP 11-282995.
English language Abstract of JP 2000-012606.

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