Barbituric acid-modified bismaleimide with diamine and polyisocy

Details Barbituric acid-modified bismaleimide with diamine and polyisocy Barbituric acid-modified bismaleimide with diamine and polyisocy

1992-07-10

1994-07-05

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525502, 525526, 525527, 525528, C08L 6302, C08L 6304, C08L 6306, C08K 507

Patent

active

053267940

ABSTRACT:
A process for manufacturing a high glass transition temperature printed circuit board comprising blending a modified bismaleimide resin into a modified epoxy resin is disclosed. Particularly the material is manufactured by blending a bismaleimide resin reacted with barbituric acid and its derivative thereof and an epoxy resin with an oxazolidone ring resulting from the reaction of a polyisocyanate and an epoxy resin modified with a secondary diamine and followed by curing. The resultant product has a high glass transition temperature, a good adhesion, flame retardancy, and a low bromine content.

REFERENCES:
patent: 4107153 (1978-08-01), Akiyama et al.
patent: 4294877 (1981-10-01), Graham
patent: 4401777 (1983-08-01), Tsuboi et al.
patent: 5041519 (1991-08-01), Pan et al.

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