Balun circuit manufactured by integrate passive device process

Details Balun circuit manufactured by integrate passive device process Balun circuit manufactured by integrate passive device process

2009-04-21

2011-11-01

Mai, Anh (Department: 2832)

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

C336S192000, C336S223000, C336S232000

Reexamination Certificate

active

08049589

ABSTRACT:
A Balun circuit manufactured by integrate passive device (IPD) process is provided. The Balun circuit includes a substrate, a first coplanar spiral structure, and a second coplanar spiral structure. At least two first left half coils of the first coplanar spiral structure are electrically connected to the corresponding two first right half coils through a first intersecting structure. At least two second left half coils of the second coplanar spiral structure are electrically connected to the corresponding two second right half coils through a second intersecting structure. The two ends of the second coplanar spiral structure are electrically connected to the innermost second left half coil and the second right half coil respectively. The first left half coils and the second left half coils are interlaced, and so are the first right half coils and the second right half coils interlaced.

REFERENCES:
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patent: 6577219 (2003-06-01), Visser
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patent: 7187179 (2007-03-01), Scaman et al.
patent: 7629860 (2009-12-01), Liu et al.
patent: 2009/0039999 (2009-02-01), Fujii et al.
patent: 2009/0146770 (2009-06-01), Lee et al.

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