Ballout for buffer

Details Ballout for buffer Ballout for buffer

2007-09-11

2007-09-11

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S749000

Reexamination Certificate

active

11026606

ABSTRACT:
In some embodiments, a multichip package includes mounting pads to mount devices, such as integrated circuits, to a substrate, such as a printed circuit board, so that devices mutually placed on opposite surfaces of the substrate do not have interfering connections or connection vias. Other embodiments are described.

REFERENCES:
patent: 6243272 (2001-06-01), Zeng et al.
patent: 6545875 (2003-04-01), Perino et al.
patent: 6882546 (2005-04-01), Miller
R. F. Graf, Modern Dictionary of Electronics, Seventh Edition, 1999, p. 535.

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