Ball-shaped device exposure apparatus and ball-shaped device...

Radiation imagery chemistry: process – composition – or product th – Registration or layout process other than color proofing

Reexamination Certificate

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Details

C430S311000, C430S396000, C355S047000, C355S077000

Reexamination Certificate

active

06300020

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a ball-like device exposure apparatus and a ball-like device manufacturing method suitable for devices such as a semiconductor shaped into a ball or part of a ball.
2. Description of the Related Art
Flat silicon wafers have conventionally been known. Recently, ball-like semiconductor devices using silicon balls with a diameter of about 1 mm are proposed.
However, conventional exposure apparatuses and semiconductor device manufacturing methods are provided to manufacture a semiconductor device by exposing a flat silicon wafer, and cannot manufacture a ball-like semiconductor device.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide an exposure apparatus and a ball-like device manufacturing method suitable for exposing a ball-like device.
To achieve the above object, a ball-like device exposure apparatus and manufacturing method according to the present invention are characterized in that a reticle having a circuit pattern surface curving in correspondence with the ball surface of a ball-like device material can be set, and a circuit pattern is exposed on the ball-like device material brought close to the circuit pattern surface of the reticle.
Other features and advantages of the present invention will be apparent from the following description taken in conjunction with the accompanying drawings, in which like reference characters designate the same or similar parts throughout the figures thereof.


REFERENCES:
patent: 3606231 (1971-09-01), Oppenheimer
patent: 5344729 (1994-09-01), Akins et al.
patent: 5955776 (1999-09-01), Ishikawa
patent: 63-23118 (1988-01-01), None

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