Ball mounting apparatus and method

Details Ball mounting apparatus and method Ball mounting apparatus and method

2007-11-22

2011-11-22

Sample, David (Department: 1783)

Metal fusion bonding

Process

Plural joints

C228S006100

Reexamination Certificate

active

08061583

ABSTRACT:
A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder balls to the first plate.

REFERENCES:
patent: 5695667 (1997-12-01), Eguchi et al.
patent: 2003/0047527 (2003-03-01), Master et al.
patent: 2003/0127501 (2003-07-01), Cheng et al.
patent: 2006/0065972 (2006-03-01), Kahn et al.
patent: 2000077837 (2000-03-01), None
patent: 2007-005653 (2007-01-01), None
Machine translation of JP 2000-077837 Ukai.
International Search Report, mailed Feb. 10, 2010, of corresponding international Application No. PCT/SG2007/000402.
International Preliminary Report on Patentability, dated Mar. 2, 2010, of corresponding international Application No. PCT/SG2007/000402.
Written Opinion, mailed Feb. 10, 2010, of corresponding international Application No. PCT/SG2007/000402.

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