Ball mount apparatus

Details Ball mount apparatus Ball mount apparatus

1999-10-12

2001-11-13

Dunn, Tom (Department: 1725)

Metal fusion bonding

With control means responsive to sensed condition

C228S012000, C228S262210

Reexamination Certificate

active

06315185

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to the improvement of a ball mount apparatus. The invention has been developed with a primary object of a BGA (ball grid array) ball mount apparatus for sucking solder balls, which will become terminals on a circuit surface of a BGA substrate, onto a mount head so as to mount the solder balls on the BGA substrate.
The present application is based on Japanese Patent Application No. Hei. 10-356979, which is incorporated herein by reference.
2. Description of the Related Art
In a background-art ball mount apparatus, a mount head is moved not only vertically but also horizontally. That is, the mount head is moved down to a ball tray position so as to suck solder balls, moved to a pickup inspection unit for inspection, and thereafter further moved to a ball mount position so as to mount the solder balls on a BGA substrate. Further, if necessary, the BGA substrate is inspected in parallel with the ball pickup inspection.
According to such a mechanism, the mount head is moved on a plane frequently. Therefore, if the cycle time was shortened, there arose a defect that the accuracy of positioning the mount head deteriorated. On the contrary, if the positioning accuracy was improved, there arose a problem that the cycle time was prolonged.
SUMMARY OF THE INVENTION
It is an object of the invention to provide a ball mount apparatus which can mount solder balls with a high accuracy of positioning and at a high speed, without necessity for a mount head to move on a plane (movement in X-axis and Y-axis directions) between a ball tray position and a ball mount position.
It is another object of the invention to provide a ball mount apparatus which can suck balls, inspect missing balls and double balls and mount the balls at a high speed and with a high accuracy, only on a Z-axis without necessity for a mount head to move on a plane.
It is still another object of the invention to provide a ball mount apparatus which can position a work, suck balls, inspect missing balls and double balls and mount the balls at a high speed and with a high accuracy, only on a Z-axis without necessity for a mount head to move on a plane.
In order to achieve the above problems, the present invention employs the following means. That is, according to the first aspect of the invention, there is provided a ball mount apparatus for mounting balls on a work by means of a mount head; wherein the work is disposed under the mount head; wherein the mount head is provided with a Z-axis driving mechanism for driving the mount head only in an up/down direction; wherein a ball tray for storing the balls is disposed at a height between the mount head and the work; and wherein the ball tray is provided with a driving mechanism for reciprocating between a ball sucking position under the mount head and a stand by position.
According to the second aspect of the invention, there is provided a ball mount apparatus for mounting balls on a work by means of a mount head; wherein the work is disposed under the mount head; wherein the mount head is provided with a Z-axis driving mechanism for driving the mount head only in an up/down direction; wherein a ball tray for storing the balls is disposed on a support base disposed at a height between the mount head and the work; wherein a missing ball inspection unit and a double ball inspection unit are provided on the support base; and wherein the support base is provided with a driving mechanism for reciprocating between a ball sucking position under the mount head and a stand by position.
According to the third aspect of the invention, there is provided a ball mount apparatus for mounting balls on a work on a substrate stage by means of a mount head; wherein the substrate stage is provided with a positioning driving mechanism; wherein the mount head is provided with a Z-axis driving mechanism for driving the mount head only in an up/down direction; wherein a support base for a ball tray and a substrate recognition camera are disposed at a height between the mount head and the work so that the support base and the substrate recognition camera do not interfere with each other; wherein the ball tray for storing balls, a missing ball inspection unit and a double ball inspection unit are provided on the support base; wherein the support base is provided with a driving mechanism reciprocating between a ball sucking position under the mount head and a stand by position; and wherein the substrate recognition camera is provided with a horizontally driving mechanism for reciprocating with respect to at least one axis between a position above the substrate stage and the stand by position.
Features and advantages of the invention will be evident from the following detailed description of the preferred embodiments described in conjunction with the attached drawings.


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