Ball grid array zero insertion force socket

Details Ball grid array zero insertion force socket Ball grid array zero insertion force socket

1999-12-03

2001-11-27

Nguyen, Khiem (Department: 2839)

Electrical connectors

With coupling movement-actuating means or retaining means in...

Including compound movement of coupling part

C439S701000

Reexamination Certificate

active

06322385

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a ball grid array zero insertion force socket for a CPU package, especially a socket having two pieces of bases, one for mounting solder balls thereon, and the other for receiving a cam lever to move a cover which is movably mounted on the bases.
2. The Related Art
Ball grid array zero insertion force (ZIF) sockets are usually installed with a cam lever for controlling insertion/withdrawal of a CPU package. For achieving low profile requirement, the cam lever is normally operated in a horizontal manner. Therefore, the cam lever is particularly received in a lever reception area which is adjacent to and not overlapped with a contact reception area to a bottom of which solder balls are mounted. However, solder balls mounted on the bottom of the contact reception area can not be soldered on a printed circuit board coplanarly due to the weight of the lever reception area. For example,
FIG. 4
illustrates a socket
1
having a cover
11
moveably engaged with a base
12
and a cam lever
3
pivotably received between the cover
11
and the base
12
and operative to move the cover
11
in opposite directions for respectively rendering the socket into a loosened status for receiving CPU pins with substantially zero insertion force or into a tightened status for engaging the inserted CPU pins with contacts retained in the base
12
. The details of this socket may be referred to U.S. patent application Ser. No. 09/128,769, which is assigned to the same assignee of the present application and enclosed herein for reference. The socket
1
has a plurality of solder balls
8
mounted to a bottom of a contact reception area
1
A which is adjacent to a lever reception area
1
B. The socket is electrically connected to a printed circuit board
9
via a reflow soldering procedure on the solder balls
8
. Since another half bottom portion of the socket
1
has no solder balls mounted thereto, some of the solder balls are apt to be cold soldered to the printed circuit board due to the unbalanced weight of the lever reception area.
It is requisite to provide a new ZIF socket which can solve the soldering problem as encountered in FIG.
4
.
SUMMARY OF THE INVENTION
The primary purpose of the present invention is to provide a zero insertion force socket which can be soldered onto a printed circuit board effectively regardless of the unbalanced weight of a lever reception area thereof.
In accordance with one aspect of the present invention, a socket comprises a first base having a plurality of solder balls attached to a bottom thereof and a second base. A cam lever is rotatably received in the second base and has a handle portion extending to exterior of the second base for operation of the cam lever. A cover is slidably mounted on the first base and the second base and fixes the first base and the second base in a juxtaposed relation.
In accordance with another aspect of the present invention, a socket assembly comprises a first base having a plurality of solder balls attached to a bottom thereof which are surface mounted to a printed circuit board. A second base is fixed to the printed circuit board and juxtaposed with the first base. A cam lever is rotatably received in the second base and has a handle portion extending to exterior of the second base for operation of the cam lever. A cover is mounted on the first base and the second base and slidable over the first base and the second base via operation of the cam lever.


REFERENCES:
patent: 6062890 (2000-05-01), Pei et al.
patent: 6077099 (2000-06-01), Pei et al.

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