Ball grid array with via interconnection

Details Ball grid array with via interconnection Ball grid array with via interconnection

1993-04-14

1994-10-11

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 522, 174260, 174266, 174 524, 257687, 257787, 361730, 361736, 361761, 361777, 29841, H05K 702, H01L 2328

Patent

active

053552830

ABSTRACT:
A ball grid array is formed by mounting and electrically connecting one or more electronic devices to a substrate in which vias are formed to interconnect electrically conductive traces formed in a surface of the substrate to solder ball pads formed at an opposite surface of the substrate. The vias are formed by mechanical or laser drilling. Solder balls are formed on each of the pads and are reflow-attached to, for instance, a printed circuit board. The electronic components can include one or more integrated circuit chips, as well as passive components. The electronic components are attached to the substrate using wirebonding, TAB or flip chip connection. An encapsulating material is applied to encapsulate the electronic devices.

REFERENCES:
patent: 4792646 (1988-12-01), Enomoto
patent: 5136366 (1992-08-01), Worp et al.
patent: 5153385 (1992-10-01), Juskey et al.
patent: 5241133 (1993-08-01), Mullen, III et al.

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