Ball grid array with recessed solder balls

Details Ball grid array with recessed solder balls Ball grid array with recessed solder balls

1998-05-11

2000-10-24

Gandhi, Jayprakash N.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174263, 361768, H05K 116, H05R 909

Patent

active

061370622

ABSTRACT:
A ball grid array for a multilayer ceramic package 500 is disclosed. Package 500 contains dielectric multilayer substrates 502 having transmission lines 504 deposited therebetween and at least a first of the substrates having receptacles 506 therein each complementarily configured to respectively receive a set of solder balls 508. Contacts 510 within the receptacles 506 connect transmission lines 504 to solder balls 508. Terminal pads 512 are deposited on a base substrate 514 substantially in registration and aligned with the solder balls 508 to define an electrical interconnection. A method of manufacturing a multilayer ceramic package 500 with a ball grid array is also disclosed which involves orienting package 500 so receptacles 506 face upward and flooding a major surface with solder balls 508. Subsequently, solder balls 508 that did not enter receptacles 506 are removed resulting in a low profile package with minimum height above a circuit board.

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patent: 5726493 (1998-03-01), Yamashita et al.
patent: 5740606 (1998-04-01), Rose
patent: 6011694 (2000-01-01), Hirakawa

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