Ball grid array with inexpensive threaded secure locking mechani

Details Ball grid array with inexpensive threaded secure locking mechani Ball grid array with inexpensive threaded secure locking mechani

1997-07-28

1999-03-23

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438106, 438118, 438126, H01L 2144, H01L 2148, H01L 2150

Patent

active

058858482

ABSTRACT:
An integrated circuit package having a die supported on a ball grid array substrate and wire bonds electrically connecting the die to the substrate. Supported on the substrate is a lock ring having a threaded opening encircling the die. Encapsulant covers the die and the wire bonds and adheres the lock ring to the substrate. A heat sink having a threaded portion can be threaded into the lock ring into an operative cooling position relative to the die and subsequently to an unthreaded removed position. When in the latter position, a repair station can be positioned over the package and the solder balls are accessible for hot gas melting thereof for removal (or replacement) of the package from the underlying motherboard.

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