Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2005-04-26
2005-04-26
Ta, Tho D. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S083000
Reexamination Certificate
active
06884088
ABSTRACT:
Solder balls are offset in the horizontal direction from fixing portions while their positional accuracy is ensured, and signal paths are shortened in a ball grid array IC socket. Contacts fixed to contact hosing apertures of a housing include base portions, contact arms, and terminal portions that extend from the lower ends of the base portions toward a circuit board. The contact arms protrude so as to extend upward and then are bent unidirectionally. The terminal portions are constituted by transition portions that link solder ball pads to the base portions, while offsetting the solder ball pads in the same direction as the contact arms. The transition portions include vertical portions which are substantially perpendicular to the solder ball pads or inclined portions angled upwardly from the solder ball pads. The vertical or inclined portions prevent movement of the solder balls, thereby preventing positional misalignment and deformation thereof.
REFERENCES:
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patent: 6431878 (2002-08-01), Hirata et al.
patent: 6676431 (2004-01-01), Kukita et al.
patent: 6676432 (2004-01-01), Kukita et al.
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patent: 20030092304 (2003-05-01), Whyne et al.
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Inoue Masashi
Kajinuma Shuji
Kaneko Hiroshi
Barley Snyder
Ta Tho D.
Tyco Electronics AMP K.K.
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