Ball grid array stack

Details Ball grid array stack Ball grid array stack

2011-08-02

2011-08-02

Chen, Xiaoliang (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S695000, C361S717000, C361S820000, C257S676000, C257S686000, C257S698000, C174S256000, C174S552000

Reexamination Certificate

active

07990727

ABSTRACT:
The invention discloses a device comprising a stack of at least two layers, which may comprise active or passive discrete components, TSOP and/or ball grid array packages, flip chip or wire bonded bare die or the like, which layers are stacked and interconnected to define an integral module. A first and second layer comprise an electrically conductive trace with one or more electronic components in electrical connection therewith. The electrically conductive traces terminate at a lateral surface of each of the layers to define an access lead. An interposer structure is disposed between the layers and provides an interposer lateral surface upon which a conductive layer interconnect trace is defined to create an electrical connection between predetermined access leads on each of the layers.

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