Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1996-03-13
1997-09-23
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439853, H01R 909
Patent
active
056697740
ABSTRACT:
A substrate mating assembly has a first substrate with at least one socket mounted thereon. The at least one socket has contact retention points provided thereon which extend into a contact receiving opening thereof. A second substrate is provided with at least one mating contact mounted thereon. The at least one mating contact has an arcuate surface and is dimensioned to be received in the contact receiving opening of the at least one socket. As the first substrate and the second substrate are electrically mated together, the at least one mating contact is received in the contact receiving opening and maintained in position therein by the cooperation of the contact retention points with the arcuate surface of the at least one mating contact. The contact retention points are provided on resilient arms which are configured to allow for the elastic distortion thereof as the at least one mating contact is brought into engagement with the at least one socket, such that when the at least one mating contact is fully inserted, the resilient arms will return toward an unstressed position to cooperate with the arcuate surface of the at least one mating contact to maintain the at least one mating contact in position.
REFERENCES:
patent: 3676838 (1972-07-01), Hartz et al.
patent: 4036549 (1977-07-01), Honda et al.
patent: 4068917 (1978-01-01), Seidler
patent: 5076794 (1991-12-01), Ganthier
patent: 5376010 (1994-12-01), Petersen
patent: 5376012 (1994-12-01), Clark
patent: 5418471 (1995-05-01), Kardos
patent: 5419710 (1995-05-01), Pfaff
patent: 5449301 (1995-09-01), Hanna et al.
patent: 5453016 (1995-09-01), Clark et al.
patent: 5498970 (1996-03-01), Petersen
Abrams Neil
Patel T. C.
LandOfFree
Ball grid array socket does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ball grid array socket, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ball grid array socket will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1937234