Ball grid array semiconductor package with solder balls fused on

Details Ball grid array semiconductor package with solder balls fused on Ball grid array semiconductor package with solder balls fused on

1997-08-20

1999-09-14

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438107, 438108, H01L 2144, H01L 2148, H01L 2150

Patent

active

059535890

ABSTRACT:
A ball grid array semiconductor package using a flexible circuit board, in which the flexible circuit board has no conductive via hole nor solder mask while having a thin structure formed at only one surface thereof with a circuit pattern having a small length. The flexible circuit board is mounted with a metallic carrier frame to achieve an easy handling thereof, a reduction in the inductance, impedance and coupling effect of adjacent circuit patterns and an easy discharge of heat from a semiconductor chip, thereby achieving an improvement in electrical performance and an improvement in heat discharge performance. The metallic carrier frame has a plurality of openings adapted to increase the bonding force between an encapsulate and constituting elements of the package, thereby removing a bending phenomenon of the package, and a method for fabricating such a BGA semiconductor package. The invention also provides a method for fabricating such a BGA semiconductor package.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 5620928 (1997-04-01), Lee et al.
patent: 5793118 (1998-08-01), Nakajima

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