Ball grid array semiconductor package with solder ball openings

Details Ball grid array semiconductor package with solder ball openings Ball grid array semiconductor package with solder ball openings

1997-08-01

2000-01-04

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 174260, 257707, 257738, 257778, 361760, 361704, 361783, H05K 114, H05K 118, H05K 720, H01L 2312

Patent

active

060116943

ABSTRACT:
An area grid array package such as a ball grid array enables high pin count and high density with no problems of routing, and at low cost. Independent and non-connected circuits are formed on a first surface and a second surface of an insulative base material, each circuit on each surface having first chip connection pads formed on one end to connect to a semiconductor chip, the other end having second solder ball pads to mount solder balls. The chip is connected to the first connection pads by either bonding wires or connection bumps extending through holes in the base material and are molded by a resin. Each solder ball pad on each surface has a solder ball attached with the solder balls extending through openings in the base material. The insulative base material and the semiconductor chip may be attached to a heat slug.

REFERENCES:
patent: 4791075 (1988-12-01), Lin
patent: 5216278 (1993-06-01), Lin et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5602059 (1997-02-01), Horiuchi et al.
patent: 5650662 (1997-07-01), Edwards et al.
patent: 5663530 (1997-09-01), Schueller et al.
patent: 5679978 (1997-10-01), Kawahara et al.
patent: 5710695 (1998-01-01), Manteghi
patent: 5737191 (1998-04-01), Horiuchi et al.

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