Ball grid array semiconductor package with ring-type heat sink

Details Ball grid array semiconductor package with ring-type heat sink Ball grid array semiconductor package with ring-type heat sink

1996-11-13

1998-01-13

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257675, H05K 720

Patent

active

057085676

ABSTRACT:
A BGA (ball grid array) semiconductor package with a ring-type heat sink is disclosed. In the above package, the heat dissipating area is enlarged by extending the edge of a chip mounting die paddle formed of a copper or copper alloy layer to the outside of the package. The ring-type heat sink is attached to the extended portion of the die paddle such that the heat sink surrounds the encapsulant of the package. The above BGA package thus directly and effectively dissipates the chip's heat through the heat sink with high thermal conductivity. A plurality of plated through holes may be formed on the chip mounting portion of the PCB of the above package. The BGA package with both the ring-type heat sink and the PTHs, the heat dissipating effect of the package is further improved.

REFERENCES:
patent: 4809053 (1989-02-01), Kuraishi
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5442234 (1995-08-01), Liang
patent: 5485037 (1996-01-01), Marrs
patent: 5532905 (1996-07-01), Moure
patent: 5586007 (1996-12-01), Funada
patent: 5598321 (1997-01-01), Mostafazadeh et al.

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