Ball grid array semiconductor package with improved heat dissipa

Details Ball grid array semiconductor package with improved heat dissipa Ball grid array semiconductor package with improved heat dissipa

1996-01-18

1998-03-17

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 257713, 361719, H05K 720

Patent

active

057294321

ABSTRACT:
A BGA (ball grid array) semiconductor package with improved heat dissipation and dehumidification effect is disclosed. The above BGA package is provided with an open through slot on the chip mounting portion of the printed circuit board and/or the heat sink. The above through slot is occluded by neither the heat conductive epoxy resin nor the solder mask but is simply opened, thus directly exposing the bottom surface of the semiconductor chip to the outside of the package and effectively performing heat dissipation and dehumidification without causing any pop corn phenomenon during the dehumidification reflow. The size of the open through slot is not larger than the semiconductor chip. The open through slot is selected from among a rectangular slot, a large circular slot, a plurality of small circular slots, a radial slot, a cross slot or any combination thereof.

REFERENCES:
patent: 4897508 (1990-01-01), Mahulikar
patent: 4964019 (1990-10-01), Belanger, Jr.
patent: 5173844 (1992-12-01), Adach
patent: 5369550 (1994-11-01), Kwon
patent: 5450283 (1995-09-01), Lin
patent: 5467251 (1995-11-01), Katchmar
patent: 5561323 (1996-10-01), Andros

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