Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-08-15
2008-11-18
Duverne, Jean F (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07452215
ABSTRACT:
Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.
REFERENCES:
patent: 6063188 (2000-05-01), Heid
patent: 6497357 (2002-12-01), Jackson et al.
patent: 6539618 (2003-04-01), Lyke
patent: 7299530 (2007-11-01), Farooq et al.
Farooq Mukta G.
Jackson Ray A.
Linnell David C.
Pompeo Frank L.
Blecker, Esq. Ira D.
Duverne Jean F
Gibb & Rahman, LLC
International Business Machines - Corporation
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