Ball grid array rework using a continuous belt furnace

Metal working – Method of mechanical manufacture – Scrap recovering or utilizing

Reexamination Certificate

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Details

C029S403400, C029S840000, C029S762000

Reexamination Certificate

active

10680622

ABSTRACT:
Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.

REFERENCES:
patent: 6063188 (2000-05-01), Heid
patent: 6497357 (2002-12-01), Jackson et al.
patent: 6539618 (2003-04-01), Lyke

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