Ball grid array re-work assembly with X-ray inspection system

X-ray or gamma ray systems or devices – Specific application – Absorption

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Details

378 21, 378 51, 439 74, 3562371, G01B 1506

Patent

active

061513806

ABSTRACT:
This invention relates to a system for the removal and reattachment of a ball grid array (BGA) package component to a printed circuit board, that is adapted for the real time X-ray inspection of BGA package removal and reattachment. The system comprises heating means comprising upper and lower heating platens juxtaposed to each other for the reception, support and application of heat to the workpiece comprising the BGA package and the printed circuit board, wherein the heating means is prepared from materials that are transmissive to X-ray radiation. Suitable x-ray transmissive materials are selected from high melting point polymers, aluminum, glasses and ceramics, and include materials having an atomic number less than 14. The system includes X-ray inspection means comprising means for generating an X-ray beam for producing an X-ray image of the workpiece, fluoroscopic imaging means for generating a visible X-ray image of the workpiece; and video camera means for viewing the X-ray image and generating a video output of the X-ray image. The system extends to the automated detection and inspection of the workpiece by conventional computer and video systems.

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