Ball grid array probing technique

Details Ball grid array probing technique Ball grid array probing technique

1998-05-05

2000-11-07

Brown, Glenn W.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, G01R 102, H01R 1232, H05K 111

Patent

active

061442135

ABSTRACT:
A printed circuit assembly includes a printed circuit board with an electrically conductive via formed therein that extends from the front side of the printed circuit board to the back side of the printed circuit board. A ball grid array package mounted to the front side of the printed circuit board is electrically connected to the electrically conductive via. A probe pad formed on the back side of the printed circuit board is laterally displaced from the electrically conductive via and is electrically connected thereto. A solder mask layer deposited on the back side of the printed circuit board includes a probe pad aperture formed therein that is substantially aligned with the probe pad so that the probe pad is exposed by the probe pad aperture formed in the solder mask layer.

REFERENCES:
patent: 5418471 (1995-05-01), Kardos
patent: 5559446 (1996-09-01), Sano
patent: 5784262 (1998-07-01), Sherman
patent: 5831444 (1998-11-01), Pai
patent: 5880590 (1999-03-01), Desai et al.
patent: 5932891 (1999-08-01), Higashi et al.
patent: 5936845 (1999-08-01), Soejima et al.
patent: 5940278 (1999-08-01), Schumacher
patent: 5952840 (1999-09-01), Farnworth et al.

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