Ball grid array package with stepped stiffener layer

Details Ball grid array package with stepped stiffener layer Ball grid array package with stepped stiffener layer

2007-07-17

2007-07-17

Dinh, Tuan (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S720000, C361S748000, C361S736000, C174S255000, C174S262000, C257S711000, C257S687000

Reexamination Certificate

active

10284371

ABSTRACT:
Electrically, thermally and mechanically enhanced ball grid array (BGA) packages are described. An IC die is mounted on a first surface of a stiffener. A first surface of a substrate is attached to a second surface of the stiffener that is opposed to the first surface of the stiffener. A bond pad of the IC die is coupled to a contact pad on the first surface of the substrate with a wire bond. The wire bond is coupled over a recessed step region in the first surface of the stiffener and through a through-pattern in the stiffener that has an edge adjacent to the recessed step region. The through-pattern in the stiffener is one of an opening through the stiffener, a recessed portion in an edge of the stiffener, or other through-pattern.

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