Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-10-03
2006-10-03
Smith, Zandra V. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S107000, C438S109000, C438S110000, C438S111000
Reexamination Certificate
active
07115442
ABSTRACT:
Disclosed is a ball grid array package with stacked center pad chips, which realizes a BGA package with stacked chips using center pad type semiconductor chips, and a method for manufacturing the same. The semiconductor chips are glued on each of upper and lower circuit boards, which have active surfaces facing each other; the chip pads are connected to each of the upper and lower circuit boards with gold wires; the upper and lower circuit boards are joined together with bumps interposed between them for electrical connection; the upper circuit board is included in a package mold; and the opposite ends of the lower circuit board are exposed to the lower portion of the package mold. The lower circuit board can be made of flexible insulation film. The exposed opposite ends of the lower circuit board can have solder balls formed thereon. Also, the opposite ends of the lower circuit board may be joined to a printed circuit board. Solder balls may be formed on the lower surface of the printed circuit board. The upper circuit board may be composed of a lead frame. The package according to the present invention is a stacked package capable of increasing memory capacity of a single package by at least 200% and combining both advantages of FBGA packages and of center pad type semiconductor chips.
REFERENCES:
patent: 5701031 (1997-12-01), Oguchi et al.
patent: 6190944 (2001-02-01), Choi
patent: 6583502 (2003-06-01), Lee et al.
patent: 2001/0006258 (2001-07-01), Hur
patent: 2002/0061607 (2002-05-01), Akram
Baik Hyung Gil
Moon Ki Ill
Au Bac H.
Hynix / Semiconductor Inc.
Smith Zandra V.
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