Ball grid array package with detachable module

Details Ball grid array package with detachable module Ball grid array package with detachable module

1994-11-29

1997-06-24

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361747, 361807, 361820, 361782, 361783, H05K 702

Patent

active

056422652

ABSTRACT:
A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device. The terminals may also be connected to the solder balls such that a component may be optionally provided either on the circuit board or in the detachable module.

REFERENCES:
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5222014 (1993-06-01), Lin
patent: 5403782 (1995-04-01), Dixon et al.
patent: 5411400 (1995-05-01), Subrahmanyan et al.
patent: 5528463 (1996-06-01), McLellan et al.
patent: 5570273 (1996-10-01), Siegel et al.

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