Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-09-20
2005-09-20
Gibson, Randy (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S800000, C361S816000, C361S752000, C361S760000, C174S034000, C174S034000, C174S260000
Reexamination Certificate
active
06947295
ABSTRACT:
A ball grid array package includes a chip having a substrate with a bottom surface, a plurality of solder bumps projecting outwardly from the bottom surface of the substrate, and an electromagnetic shield including a housing that defines an inner space which receives the chip and the solder bumps therein, and a bottom opening for access into the inner space. The solder bumps project outwardly of the inner space through the bottom opening in the housing.
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Benq Corporation
Gibson Randy
Ladas & Larry LLP
Levi Dameon E.
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