Ball grid array package with an electromagnetic shield...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S800000, C361S816000, C361S752000, C361S760000, C174S034000, C174S034000, C174S260000

Reexamination Certificate

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06947295

ABSTRACT:
A ball grid array package includes a chip having a substrate with a bottom surface, a plurality of solder bumps projecting outwardly from the bottom surface of the substrate, and an electromagnetic shield including a housing that defines an inner space which receives the chip and the solder bumps therein, and a bottom opening for access into the inner space. The solder bumps project outwardly of the inner space through the bottom opening in the housing.

REFERENCES:
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patent: 5400949 (1995-03-01), Hirvonen et al.
patent: 5548084 (1996-08-01), Tracy
patent: 5694300 (1997-12-01), Mattei et al.
patent: 5838551 (1998-11-01), Chan
patent: 5886876 (1999-03-01), Yamaguchi
patent: 6297967 (2001-10-01), Davidson et al.
patent: 6362516 (2002-03-01), Waters
patent: 6472724 (2002-10-01), Matsuzawa et al.
patent: 6826053 (2004-11-01), Kato et al.
patent: 6881896 (2005-04-01), Ebihara
patent: 6882040 (2005-04-01), Hosoya

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